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? 2001-2013 microchip technology inc. ds20001389e-page 1 tc1410/tc1410n features ? latch-up protected: withstands 500 ma reverse current ? input withstands negative inputs up to 5v ? electrostatic discharge (esd) protected: 2.0 kv (hbm) and 400v (mm) ? high peak output current: 0.5a ? wide input supply voltage operating range: - 4.5v to 16v ? high capacitive load drive capability: - 500 pf in 25 ns ? short delay time: 30 ns typical ? consistent delay times with changes in supply voltage ? matched delay times ? low supply current - with logic ? 1 ? input: 500 a - with logic ? 0 ? input: 100 a ? low output impedance: 16 ? available in space-saving 8-pin msop package ? pinout ? same as tc1411/tc1412/tc1413 applications ? switch mode power supplies ? line drivers ? pulse transformer drive ? relay driver general description the tc1410/tc1410n are 0.5a cmos buffers/drivers. they do not latch up under any conditions within their power and voltage ratings. they are not subject to damage when up to 5v of noise spiking of either polarity occurs on the ground pin. they can accept, without damage or logic upset, up to 500 ma of current of either polarity being forced back into their output. all terminals are fully protected against electrostatic discharge (esd) up to 2.0 kv (hbm) and 400v (mm). as mosfet drivers, the tc1410/tc1410n can easily charge a 500 pf gate capacitance in 25 ns with matched rise and fall times. to ensure the mosfet?s intended state will not be affected even by large transients, low enough impedance in both the ?on? and ?off? states are provided. the leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. package type 8-pin msop/pdip/soic 1 2 3 4 v dd 5 6 7 8 out gnd v dd in nc gnd out tc1410 nc = no connection 2 6,7 inverting 2 6,7 non-inverting 1 2 3 4 5 6 7 8 tc1410n v dd in nc gnd v dd out gnd out note: for proper operation, duplicate pins must be connected together. 0.5a high-speed mosfet drivers
tc1410/tc1410n ds20001389e-page 2 ? 2001-2013 microchip technology inc. functional block diagram effective input c = 10 pf output input gnd v dd 300 mv 4.7v inverting non-inverting output output tc1410 tc1410 tc1410n
? 2001-2013 microchip technology inc. ds20001389e-page 3 tc1410/tc1410n 1.0 electrical characteristics absolute maximum ratings? supply voltage ..................................................... +20v input voltage ...................... v dd + 0.3v to gnd ? 5.0v power dissipation (t a 70c) msop .......................................................... 340 mw pdip ............................................................ 730 mw soic............................................................ 470 mw storage temperature range .............. -65c to +150c maximum junction temperature ...................... +150c ? notice: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. dc electrical characteristics electrical specifications: unless otherwise noted, over the op erating temperature range with 4.5v v dd 16v. typical values are measured at t a =+25c, v dd = 16v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.0 ? ? v logic ? 0 ?, low input voltage v il ??0.8v input current i in -1 ? 1 a 0v v in v dd, t a =+25c -10 ? 10 -40c t a +85c output high output voltage v oh v dd ? 0.025 ? ? v dc test low output voltage v ol ? ? 0.025 v dc test output resistance r o ?1622 v dd =16v, i o =10ma, t a =+25c ?2028 0c t a +70c ? 20 28 -40c t a +85c peak output current i pk ?0.5?av dd =16v latch-up protection withstand reverse current i rev ? 0.5 ? a duty cycle 2%, t 300 s, v dd =16v switching time ( note 1 ) rise time t r ?2535nst a =+25c ?2740 0c t a +70c ? 29 40 -40c t a +85c, figure 4-1 fall time t f ?2535nst a =+25c ?2740 0c t a +70c ? 29 40 -40c t a +85c, figure 4-1 delay time t d1 ?3040nst a =+25c ?3345 0c t a +70c ? 35 45 -40c t a +85c, figure 4-1 delay time t d2 ?3040nst a =+25c ?3345 0c t a +70c ? 35 45 -40c t a +85c, figure 4-1 note 1: switching times ensured by design.
tc1410/tc1410n ds20001389e-page 4 ? 2001-2013 microchip technology inc. power supply power supply current i s ?0.51.0mav in =3v, v dd =16v ? 0.1 0.15 v in =0v temperature characteristics electrical specifications: unless otherwise noted, all parameters apply with 4.5v v dd 16v. parameters sym min typ max units conditions temperature ranges specified temperature range (c) t a 0?+70oc specified temperature range (e) t a -40 ? +85 oc maximum junction temperature t j ? ? +150 oc storage temperature range t a -65 ? +150 oc package thermal resistances thermal resistance, 8l-msop ja ?211?oc/w thermal resistance, 8l-pdip ja ?89.3?oc/w thermal resistance, 8l-soic ja ? 149.5 ? oc/w dc electrical characte ristics (continued) electrical specifications: unless otherwise noted, over the op erating temperature range with 4.5v v dd 16v. typical values are measured at t a =+25c, v dd = 16v. parameters sym min typ max units conditions note 1: switching times ensured by design.
? 2001-2013 microchip technology inc. ds20001389e-page 5 tc1410/tc1410n 2.0 typical performance curves note: unless otherwise indicated, over operating temperature range with 4.5v v dd 16v. figure 2-1: quiescent supply current vs. supply voltage. figure 2-2: input threshold vs. supply voltage. figure 2-3: high-state output resistance vs. supply voltage. figure 2-4: quiescent supply current vs. temperature. figure 2-5: input threshold vs. temperature. figure 2-6: low-state output resistance vs. supply voltage. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or ta bles, the data presented may be outside the specified operating range (e.g., outside specified power suppl y range) and therefore outs ide the warranted range. 0 100 200 300 400 500 16 14 12 10 8 6 4 v in = 3v v in = 0v t a = +25 c i supply ( a) v dd (v) 1.1 1.2 1.3 1.4 1.5 1.6 16 14 12 10 8 6 4 t a = +25 c v dd (v) v threshold (v) v ih v il 0 10 20 30 40 50 16 14 12 10 8 6 4 v dd (v) r ds-on (ohms) t a = -40 c t a = +25 c t a = +85 c -40 -20 0 20 40 60 80 0 100 200 300 400 500 i supply ( a) v in = 3v v in = 0v v supply = 16v temperature ( c) -40 -20 0 20 40 60 80 1.1 1.2 1.3 1.4 1.5 1.6 v supply = 16v temperature ( c) v threshold (v) v ih v il 0 10 20 30 40 50 16 14 12 10 8 6 4 v dd (v) r ds-on (ohms) t a = -40 c t a = +25 c t a = +85 c
tc1410/tc1410n ds20001389e-page 6 ? 2001-2013 microchip technology inc. note: unless otherwise indicated, over op erating temperature range with 4.5v v dd 16v. figure 2-7: rise time vs. supply voltage. figure 2-8: propagation delay vs. supply voltage. figure 2-9: rise and fall times vs. capacitive load. figure 2-10: fall time vs. supply voltage. figure 2-11: propagation delay vs. supply voltage. figure 2-12: propagation delays vs. capacitive load. 0 20 40 60 80 100 16 14 12 10 8 6 4 t a = -40 c t a = +25 c t a = +85 c v dd (v) c load = 500 pf t rise (nsec) 0 20 40 60 80 100 16 14 12 10 8 6 4 t a = -40 c t a = +25 c t a = +85 c v dd (v) c load = 500 pf t d1 (nsec) 0 500 1000 1500 2000 2500 3000 3500 0 20 40 60 80 100 t fall t rise t a = +25 c v dd = 16v t rise , t fall (nsec) c load (pf) 0 20 40 60 80 100 16 14 12 10 8 6 4 v dd (v) t fall (nsec) t a = -40 c c load = 500 pf t a = +25 c t a = +85 c 0 20 40 60 80 100 16 14 12 10 8 6 4 v dd (v) c load = 500 pf t d2 (nsec) t a = -40 c t a = +25 c t a = +85 c 0 500 1000 1500 2000 2500 3000 3500 25 29 33 37 41 45 t d2 t d1 t a = +25 c v dd = 16v c load (pf) propagation delays (nsec)
? 2001-2013 microchip technology inc. ds20001389e-page 7 tc1410/tc1410n 3.0 pin descriptions the descriptions of the pins are listed in table 3-1 . 3.1 supply input (v dd ) the v dd input is the bias supply for the mosfet driver and is rated for 4.5v to 16v with respect to the ground pin. the v dd input should be bypassed to ground with a local ceramic capacitor. t he value of the capacitor is chosen based on the capacitive load that is being driven. a value of 1.0 f is suggested. 3.2 control input (in) the mosfet driver input is a high-impedance, ttl/cmos-compatible input. the input also has 300 mv of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. 3.3 cmos push-pull output (out, out ) the mosfet driver output is a low-impedance, cmos, push-pull style output, capable of driving a capacitive load with 0.5 a peak currents. 3.4 ground (gnd) the ground pins are the return path for the bias current and for the high peak curren ts that discharge the load capacitor. the ground pins should be tied into a ground plane or have very short traces to the bias supply source return. table 3-1: pin function table pin no. tc1410 msop, pdip, soic tc1410n msop, pdip, soic description 1v dd v dd supply input, 4.5v to 16v 2 in in control input 3 nc nc no connection 4gnd gndground 5gnd gndground 6out out cmos push-pull output, common to pin 7 7out out cmos push-pull output, common to pin 6 8v dd v dd supply input, 4.5v to 16v
tc1410/tc1410n ds20001389e-page 8 ? 2001-2013 microchip technology inc. 4.0 applications information figure 4-1: switching time test circuit. c l = 500 pf 0.1 f 1.0 f inverting driver non-inverting driver input v dd = 16v input output t d1 t f t r t d2 input: 100 khz, square wave, t rise = t fall 10 ns output input output t d1 t f t r t d2 +5v 10% 90% 10% 90% 10% 90% v dd 0v 90% 10% 10% 10% 90% +5v v dd 0v 0v 0v 90% 4, 5 2 6, 7 1, 8 tc1410 tc1410n tc1410 tc1410n
? 2001-2013 microchip technology inc. ds20001389e-page 9 tc1410/tc1410n 5.0 packaging information 5.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example tc1410 cpa^^ 256 1316 3 e or tc1410 cpa256 1316 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code rohs compliant jedec designator for matte tin (sn) * this package is rohs compliant. the rohs compliant jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip pa rt number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e
tc1410/tc1410n ds20001389e-page 10 ? 2001-2013 microchip technology inc. 8-lead soic (3.90 mm) example nnn tc1410c oa^^ 1316 256 3 e or 8-lead msop (3x3 mm) example 1410e 316256 tc1410 coa1316 256
? 2001-2013 microchip technology inc. ds20001389e-page 11 tc1410/tc1410n n e1 note 1 d 12 3 a a1 a2 l b1 b e e eb c
tc1410/tc1410n ds20001389e-page 12 ? 2001-2013 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 2001-2013 microchip technology inc. ds20001389e-page 13 tc1410/tc1410n note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
tc1410/tc1410n ds20001389e-page 14 ? 2001-2013 microchip technology inc.
? 2001-2013 microchip technology inc. ds20001389e-page 15 tc1410/tc1410n 1rwh for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging 8$
tc1410/tc1410n ds20001389e-page 16 ? 2001-2013 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging ua
? 2001-2013 microchip technology inc. ds20001389e-page 17 tc1410/tc1410n 8-lead plastic micro small outline package (ua) [msop] note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
tc1410/tc1410n ds20001389e-page 18 ? 2001-2013 microchip technology inc. notes:
? 2001-2013 microchip technology inc. ds20001389e-page 19 tc1410/tc1410n appendix a: revision history revision e (june 2013) the following is the list of modifications: ? updated the values for electrostatic discharge in the features and general description columns. ? updated the pin description table in section 3.0, pin descriptions . ? updated package marking information and drawings in section 5.0, packaging information . ? minor grammatical and spelling corrections.
tc1410/tc1410n ds20001389e-page 20 ? 2001-2013 microchip technology inc. notes:
? 2001-2013 microchip technology inc. ds20001389e-page 21 tc1410/tc1410n product identification system to order or obtain information, e.g., on pricing or de livery, refer to the factory or the listed sales office . device : tc1410: 0.5a single mosfet driver, inverting tc1410n: 0.5a single mosfet driver, non-inverting temperature range: c = 0c to +70c e = -40c to +85c package: oa = plastic soic, (150 mil body), 8-lead oa713 = plastic soic, (150 mil body), 8-lead (tape and reel) ua = plastic micro small outline (msop), 8-lead * ua713 = plastic micro small outline (msop), 8-lead * (tape and reel) pa = plastic dip (300 mil body), 8-lead * msop package is only available in e-temp. part no. x /xx package temperature range device examples: a) tc1410coa: 0.5a single mosfet driver, soic package, 0c to +70c. b) tc1410cpa: 0.5a single mosfet driver, pdip package, 0c to +70c. c) tc1410eua713: tape and reel, 0.5a single mosfet driver, msop package, -40c to +85c. a) tc1410ncpa: 0.5a single mosfet driver, pdip package, 0c to +70c. b) tc1410nepa: 0.5a single mosfet driver, pdip package, -40c to +85c. c) tc1410neua: 0.5a single mosfet driver, msop package, -40c to +85c.
tc1410/tc1410n ds20001389e-page 22 ? 2001-2013 microchip technology inc. notes:
? 2001-2013 microchip technology inc. ds20001389e-page 23 tc1410/tc1410n the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchip?s customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or de velopment tool of interest. to register, access the microchip web site at www.microchip.com . under ?support?, click on ?customer change notification? and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sa les offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support
tc1410/tc1410n ds20001389e-page 24 ? 2001-2013 microchip technology inc. notes:
? 2001-2013 microchip technology inc. ds20001389e-page 25 tc1410/tc1410n information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights. trademarks the microchip name and logo, th e microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademar ks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered tradema rks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, a pplication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2001-2013, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 978-1-62077-243-0 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip pr oducts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperi pherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 ==
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